BCSI PACK DESIGN distribution in Japan
Suntex Co.,Ltd. has pack design distribution in Japan.
BCSI Systems BV is a software house based in The Netherlands. Where we have been developing CAD and CAM solutions for the die-making and packaging industry for over 25 years now.
It all started in 1984 when the company’s founder Rene Bastians started development on the DieCad system for a die maker in the Netherlands. This initial development proofed so interesting that in 1989 BCSI Systems was founded, a system house dedicated to the packaging and die making industry. The start of the PackDesign suite.
We are proud that our customer base includes some of the largest carton makers and die makers in Europe and overseas. We try to provide our customers with complete solutions and whenever needed we are flexible enough to customize our system to meet specific needs.
Since starting our solutions in CAD we have always had a close connection to (CNC) machinery such as Lasers, flatbed plotters, water jets, routers, etc… Altogether we have always been focused on the Packaging (carton boxes) and die making (carton boxes) industry with an occasional sidestep into the Gasket business and other die-less cutting related industries.
Founded in 1989 as a system house dedicated to the packaging and die making industry. Since then the company continues at the heart of revolutions in computing and automatization dedicated to this industry.
At the basis of our products lies a long history of experience in die making and packaging industry as well as the design of information systems. All this results in an integrated software environment, which is suitable for the various disciplines in the graphical industry.
The PackDesign suite was and still is a product born out of a close relationship with outstanding die-makers, packaging and printing companies in many different countries throughout the world.
Today, BCSI is a well-established company in the Netherlands with representations and agents active for BCSI all over the world.
PackDesign is a fully integrated open and modular Windows based 3D and 2D Cad/Cam platform for the packaging and die making industry. The various modules are configurable and tunable as add-ons. Some modules are also available as standalone applications.
More than 50 man-years of research and development together with the contribution of our customers have brought PackDesign to the leading edge in this market. Our customers are free in the choice of their equipment; we make sure that interfacing is never a problem. No matter how small or big your company is, PackDesign is always optimized to your needs.